Special process for processing high temperature mica board PCB

2019-08-19 21:56:30 405

1: Introduction of processed products into PCB panel shaped high temperature resistant mica board

The high temperature resistant mica board has excellent high temperature insulation performance and temperature resistance up to 1000. It has good cost performance in high temperature insulation materials.

The high temperature resistant mica panels have excellent electrical insulation performance and the voltage failure index of the current products reaches 20KV / mm.

The high temperature resistant mica plate has excellent flexural strength and processing properties, high flexural strength and excellent toughness, and can be formed into various molded parts without lamination by lathe, milling machine and drill.

The high temperature resistant mica panel has excellent environmental performance. The product does not contain asbestos, it emits less smoke and odor when heated, and it is smoke-free and tasteless.

2: Special shaped treatment of high temperature resistant mica board and treatment

1. drilling

This is a common processing method for PCB manufacturing plants. Whether it is the PCB test device or the post-elimination of printed circuit boards, it is subjected to "drilling". The large-scale printed circuit board plant usually has its own drill room. This is not intimate, but drilling room work is not an easy task, however, compared to standalone equipment, the consumables and equipment used in the drill room are special drilling rigs, drills, rubber granules, wooden slabs, aluminum slabs, etc. The loss of the forest and that of the skate are enormous and many small businesses usually make a fortune by providing a drill bit and a strawberry.

In addition, the new LED lamp cover retention insulation has been widely used in recent years, due to its popularity as an energy-efficient industry and its many small lamps, further widening the field of view. application of the insulation board. In general, the method of treating insulating parts that hold LEDs is to drill holes and then circle a circle. The treatment method is simple and the market is huge, but the characteristics are not high and the profit is low;

2, Computer

Computer Cymbal is the name of Southern China. It is said to be CNC, also called a PCB processing center. It's actually a meaning. Or the surface), the category of the slope is relatively small, and the flat computer is very common, as the insulating joints, the insulating rods, the star-shaped wheels and other small pieces of treatment are treated by computers. Big features are sensitive, fast and powerful, and they are well used and commonly used treatment methods;

3, PCB cutting

This is a common method of treating PCBs on the market. Ordinary stores have a generally rough cutter, and the tolerance can be controlled to less than 5 mm. It's scary to say, I see After many shops or companies that manufactured epoxy panels in Dongguan, the company that has been doing it for about 5 years continues to cut at the angle welding machine. Some countries produce capital, which seems to be a small skill. There is no technical content in this way, but it is sometimes very profitable, for example, if it is divided into normal calculations, a half and a half is cut into 8 small pieces, there is a small supplement, but those who sell the painting have a method to cut it. For 10 small leaves, if the amount is large, the benefits will be very impressive;

4, milling machine / lathe

The products processed by this method of PCB processing are generally products such as parts and components. Therefore, if the method of treatment of epoxy panels is used exclusively, the life of the company will be considerably reduced, but if the device is used, these two types of equipment are necessary, that is to say if the panel Thicker epoxy is processed, Milling machines and lathes are the best choice;

Manufacturer of printed circuits from China, specializing in the manufacture of printed circuits for various processes and materials, manufacturing of printed circuits in layer 1-34.