Process difference between FR4 board and aluminum substrate in PCB board
When drilling aluminum substrates, you can choose two kinds of drilling methods. One is to use a CNC drilling machine to drill, but it is especially easy to burn the main shaft. The advantage of drilling with a drilling machine is that the drilled hole wall is particularly smooth, without burrs, and has high precision. The second type can be drilled with a boring machine, but it is easy to have burrs, and the precision is not so high, it is easy to drill, so the aluminum substrate will be higher than the cost of the FR4 board, which is mainly high here because the damage to the rig is relatively large.
In addition, there is no difference between single-sided aluminum substrate and FR4 single-panel.
The double-sided aluminum substrate needs to be pressed first, and then the rest is the same process as the FR4 double panel.
The aluminum substrate is similar to the single-panel process of FR4, mainly because there is no electroplating process.
The FR4 board is a code name for a flame-resistant material grade. It means a material specification that the resin material must be self-extinguishing after being burned. It is not a material name, but a material grade, so the current general circuit board There are many types of FR-4 grade materials used, but most of them are composites made of so-called four-function (Tera-Function) epoxy plus filler (Filler) and glass fiber.
FR-4 Epoxy Glass Cloth Laminate, according to the application, the industry is generally called: FR-4 Epoxy Glass Cloth, Insulation Board, Epoxy Board, Epoxy Board, Brominated Epoxy Board, FR-4 , fiberglass board, fiberglass board, FR-4 reinforcing board, FPC reinforcing board, flexible circuit board reinforcing board, FR-4 epoxy board, flame retardant insulation board, FR-4 laminated board, epoxy board , FR-4 light board, FR-4 glass fiber board, epoxy glass cloth board, epoxy glass cloth laminate, circuit board drilling pad. Main technical features and applications: stable electrical insulation performance, good flatness, smooth surface, no pits, thickness tolerance standards, suitable for high performance electronic insulation requirements, such as FPC reinforcement board, PCB drilling pad, glass Fiber meson, potentiometer carbon film printing fiberglass board, precision planetary gear (wafer grinding), precision test board, electrical (electrical) equipment insulation struts, insulation pads, transformer insulation board, motor insulation, grinding gear, Electronic switch insulation board, etc.
The aluminum substrate is a metal-based copper clad plate with good heat dissipation function. Generally, the single panel is composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer.
Also used for high-end use is designed as a double panel, the structure is circuit layer, insulation layer, aluminum base, insulation layer, circuit layer. A very small number of applications are multi-layer boards, which can be made of ordinary multi-layer boards combined with an insulating layer and an aluminum base.
The LED aluminum substrate is the PCB board, which is also the meaning of the printed circuit board. The material of the circuit board is aluminum alloy. In the past, the material of our general circuit board was glass fiber, but because the LED heat is large, the circuit board for LED lamps is generally It is an aluminum substrate that can conduct heat quickly. The circuit board for other equipment or electrical appliances is also a fiberglass board.
The aluminum substrate is similar to the single panel process of FR4. Mainly there is no electroplating process.
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