Circuit board resin plug hole prevents PCB explosion
The PCB is made of resin plug hole. This process is often because of BGA parts, because the traditional BGA may do VIA to the back between the PAD and the PAD to trace the line, but if the BGA is too dense, the VIA is caused.
When you can't get out, you can go directly from the PAD hole to the other layer to go the wire, and then fill the hole with resin to turn the copper into PAD, also known as the via in pad.
If you just do via on the PAD and do not use the resin plug hole, it is easy to cause the short-circuit on the back side and the front side of the open solder.
PCB board resin plug hole process includes drilling, plating, plugging, baking, grinding, drilling the hole, then sealing the resin, and finally grinding it to smooth it, grinding
Because the resin after the flat is copper-free, it needs to be turned into a PAD again. These processes are made before the original PCB board drilling process, that is, the plug hole first.
The holes are well treated, and then the other holes are drilled and the original process is followed.
If the plug hole is not plugged, there is a bubble in the hole. Because the bubble is easy to absorb moisture, the plate may explode when it passes through the tin furnace. However, if there are bubbles in the hole during the process of plugging, the bubble will be resin when baking. Extrusion, causing a situation where one side is concave and protrudes. At this time, the defective product can be detected, and the board with bubbles does not necessarily explode, because the main cause of the explosion is moisture, so if the board or board is just shipped, When the upper part is baked, it will not cause the explosion.
PCB manufacturer from China: Juding Circuit Technology, providing PCB board manufacturing, multi-layer PCB board, TG board, HDI board, Rogers board, 1-3-4 layer board manufacturing production,Feel free to contact the staff to find out more!