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PCB board metallized edge: gold finger process

2019-09-02 20:05:36 458

This paper relates to the field of circuit board manufacturing, and in particular to a circuit board gold-plated nickel-plated process.

With the development of the industry, more and more electronic products are beginning to use the bonding process to minimize the volume of the product, so more and more PCBs use electroplated nickel-gold surface technology.


In the mainstream manufacturing process, the gold-plated finger process can realize the gold plating of the soldering point board, but it is necessary to separately make the lead-through soldering point and the board edge, and remove it after gold plating, which is only suitable for the soldering point on the side of the board. The electroplating nickel-gold process has a simple production process and does not require separate lead wires, but can only be plated on the top of the solder joints, and cannot be plated with gold.


Technical realization elements:

This paper provides a circuit board-side gold-plated nickel-gold process that can simultaneously achieve top-level gold plating and edge-edge gold plating.


In order to solve the above problems, a circuit board gold-plated nickel-gold plating process is provided, which comprises: forming an etching groove on a copper surface of a circuit board by etching, the etching groove extending along a pattern of gold to be edged Thereby exposing the sidewall of the copper layer that needs to be gold-coated; applying a dry film on the copper layer, and forming a window on the dry film, the window corresponding to the etching groove and its surrounding The copper plate area is required to be covered and the side wall is exposed; the circuit board is plated with nickel gold so that the copper plate region and the side wall are plated with a layer of nickel gold.


Preferably, if the copper plate area is a separate pad, a separate lead is added thereto.

Preferably, the distance between the circumferential edge of the fenestration and the circumferential edge of the copper plate region is 4 mils.

The method herein can simultaneously form nickel gold on the upper surface and the sidewall of the copper plate region during electroplating, thereby simultaneously achieving gold plating on the top layer and gold plating on the edge.


Detailed ways

The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

A circuit board gold-plated nickel-gold plating process is provided, comprising: forming an etching groove on a copper surface of a circuit board by etching

1, the etching groove 1 extends along the pattern of gold to be edged to expose the gold-coated sidewall 3 of the copper layer 2; the dry film 4 is pasted on the copper layer 2, and the dry film is Forming a fenestration 6 on the etched groove 1 and the copper plate region 5 required to be covered with gold, and exposing the side wall; electroplating the circuit board with nickel gold, Thereby, the copper plate region 5 and the side wall 3 are plated with a layer of nickel gold.


When the circuit board is fabricated, first, as shown in FIG. 1, a dry film 9 is attached on the outer side wall of the copper layer 2, and a window opening 8 is formed on the dry film 9, which corresponds to the to-be-formed The groove 1 is etched and corresponds to its shape. Then, etching is performed to form the etching bath 1. Wherein, one side wall 3 of the etching groove 1 is a side wall which needs to be side-coated with gold in a subsequent process.


Then, a dry film 4 is attached on the outer wall of the copper layer 2, and at the same time, the dry film 4 is formed with a window opening corresponding to the copper plate region 5 to be subjected to the top plating and the edge of the gold plate and the etching groove 1 around it. 6.

Finally, the board is electroplated. Since the upper surface and the side surface of the copper plate region 5 are not covered with the dry film 4 at this time, nickel gold is simultaneously formed on the upper surface and the side wall of the copper plate region 5 during the plating, thereby simultaneously realizing the top plating and the edge plating.


Preferably, if the copper plate region 5 is a separate pad, a separate lead is added thereto.

Preferably, the distance between the circumferential edge of the fenestration 6 and the circumferential edge of the copper plate region 5 is 4 mils. In this way, the medicinal water can be conveniently placed into the sidewall of the pad, and when the nickel-gold is electroplated, the edge of the slab is gold-coated.


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