Printed circuit board plating equipment features and plating process
Printed circuit boards can be industrialized and produced on a large scale, mainly due to the patented formulation of electroless copper plating and the patented colloidal palladium formula introduced by some well-known companies in the world in the 1960s. Printed circuit board through-holes use electroless copper plating to lay a good foundation for industrialization, large-scale production and automated production. It has also become one of the basic processes for the production of printed circuit boards accepted by various manufacturers.
(1) Graphic plating method
Copper clad plate, a hole, a deburring, a surface cleaning treatment, a weak corrosion, an activation, an electroless copper plating, a full-plate copper plating, an etching plating pattern, a graphic electroplating copper, a tin-plated lead or a nickel-gold-removing resist Agent-etching-hot-melt-coating solder mask
(2) Full plate plating method
Cladding board, a hole, a deburring, a surface cleaning treatment, a weak corrosion, an activation, an electroless copper plating, a full-plate copper plating, a screen printing, a screen printing, an etching, a resist, a solder resist, a hot air leveling or Electroless nickel plating has an electroless copper plating process in the production process of the above printed circuit board. Electroless copper plating is an important part in the production process of printed circuit boards. Electroless copper plating is characterized in that the solution contains a complexing agent or a chelating agent. The reducing agent is formaldehyde.
The complexing agent in the electroless copper plating solution and the substance such as formaldehyde may cause harm to the environment, and it is very difficult to treat in the wastewater. In addition, the maintenance and management of the electroless copper plating bath is also difficult. However, electroless copper plating is still a process that cannot be ignored in the production of printed circuit boards.
Features of PCB printed circuit board automatic plating production line:
1, advanced design is suitable for the production and application of various circuit boards;
2, can accurately control the addition of various syrups to achieve maximum effect;
3, rich work experience, with a Chinese medicine water supplier, can provide a holistic plan to meet customer requirements;
4. The cathode is oscillated at an angle of 15°, and the electroplating tank is provided with a motor vibration device, which provides the plating quality of the fine circuit and the small aperture;
5, attached to the cathode float to provide plating uniformity;
6, the monthly output of 2,000 square meters to 30,000 square meters, can choose deep tank or money trough, the anode is copper rod or titanium-coated copper.