Analysis of the top ten skills of PCB board high four-layer wiring
The PCB board is divided into many layers. What are the techniques for the high four-layer wiring? The following is for everyone to introduce, I hope to have some help for everyone.
1:3 or more connections, try to let the lines pass through the points in order to facilitate testing, and the line length is as short as possible.
2: Try not to put the wires between the pins, especially between and around the integrated circuit pins.
3: The lines between the different layers should not be parallel as much as possible to avoid the formation of actual capacitance.
4: The wiring should be as straight as possible, or a 45-degree fold line to avoid electromagnetic radiation.
5: The ground wire and power cable are at least 10-15 mils (for logic circuits).
6: Try to connect the paved polyline to increase the grounding area. Lines and lines are as neat as possible.
7: Pay attention to the uniform discharge of components for installation, plug-in and welding operations. The text is discharged in the current character layer, the position is reasonable, pay attention to the orientation, avoid being blocked, and easy to produce.
8: Component emissions are considered in the structure. The positive and negative components of the chip components should be packaged and finally marked to avoid space conflicts.
9: Currently printed boards can be used for 4-5 mil wiring, but usually 6 mil line width, 8 mil line spacing, 12/20 mil pads. The wiring should take into account the effects of sinking current, etc.
10: The function block components are put together as much as possible, and the components near the LCD such as zebra strips cannot be too close.
11: The hole should be coated with green oil (set to a negative value).
12: It is best not to place pads, empty space, etc. under the battery holder. The PAD and VIL are reasonable in size.
13: After the wiring is completed, carefully check whether each of the wires (including NETLABLE) is actually connected (available lighting method).
14: The oscillating circuit component is as close as possible to the IC, and the oscillating circuit is as far as possible from the susceptible area such as the antenna. Under the crystal
Shenzhen, China PCB manufacturer: provide you with: PCB prototype, batch board, 1-34 layer PCB board, impedance board, TG board, HDI board, Rogers board, microwave board, RF board, Radar board, thick copper foil board, etc. . Process and material PCB boards for the manufacture and production of PCB boards. Welcome to consult the staff for more details!