Since the details of the PCB board involve a confidentiality agreement, we will not elaborate.
In the Specification Parameters column, we detail our manufacturing capabilities.
Traditional rigid plate processing capability
Number of layers: 1-34L
Plate thickness: 0.2mm-8.0mm
Finished product size: 22.5''* 49''
Minimum line width / spacing: 3.0mil
Maximum thickness ratio: 40:1
Minimum mechanical aperture: 4mil
Hole to conductor distance: 3.5mil
Impedance tolerance (Ω): ±3 (<30) ± 10% (≥ 30)
Surface treatment process: lead-spray tin, chemical immersion gold, electroless nickel-plated palladium gold, immersion tin, immersion silver, full gold plating, organic coating treatment, lead-free spray tin, hard gold plating, soft gold plating, gold finger and so on.
Material: FR-4, high TG, halogen free, high frequency (Rogers, Arlon \ Taconic, Nelco, Taixing Microwave F4B, Isola ...)
Soft and hard composite board processing capability
Mass production capacity using high-density rigid-flex board products
Number of layers / flexible layers: 36/10
Minimum line width: 3.0 / 3.0mil
Plate thickness ratio: 20:1
Hole to conductor distance: 6mil
Impedance tolerance (Ω): 10%
Surface treatment process: lead spray tin, chemical immersion gold, immersion tin, immersion silver, organic coating treatment, lead-free spray tin, hard gold plating, soft gold, silver paste, etc.
Impedance control technique
3 + C + 3: regular production
4 + C + 4: small amount + regular production
Laser blind hole plating and filling: regular production
Minimum laser drilling (mil): 4
Metal substrate processing capability
Number of layers: 1-12L (metal substrate and metal core board), 2-24L (buried/embedded metal and cold copper and thick copper)
Plate thickness: 0.5-7.0mm Size: Maximum: 610 * 610, Minimum: 5 * 5mm
Machining: X / Y / Z accuracy ± 0.03mm, horn hole, screw hole
Thermal conductivity of thermal conductive material: conventional thermal conductive material: 1-4W / m.k; custom 5-12W / M.K;
Maximum wiring copper thickness: 28OZ
Metal surface treatment: aluminum ordinary oxidation, aluminum hard oxidation, aluminum chemical passivation, sand blasting, wire drawing, surface plating treatment
Surface treatment process: hot air leveling, chemical immersion gold, electroless nickel-plated palladium gold, immersion tin, immersion silver, full gold plating, electroplating soft/hard gold, organic coating treatment, etc.
Type: pre-bonding, post-bonding, sintering process, metal interlayer, buried metal block, cold plate
Interior: vacuum packaging + foam.
Appearance: foam + carton.
Choose a special package based on the quantity.