PCB

Electroless gold-plated PCB

PCB supplier from China - Juding Circuit Technology: We have our own PCB manufacturing factory, which can provide you with PCB prototype manufacturing, PCB batch manufacturing, 1-34 layer PCB board, high precision board, Rogers board, impedance board, TG Material board, mixed press board, chemical immersion gold board, soft and hard board, provide you with one-stop service, our contact email: judingdianlu1@163.com

  • Surface treatment: 1-34L
  • Plate: 0.5-17.5mm
  • Maximum board size: 0.1mm
  • Maximum plate thickness ratio: 3mil
  • Maximum copper thickness: 1+n+1、2+n+2、3+n+3
  • Impedance control: 3/3mil
  • Minimum line width and spacing: +/-5%
  • HDI type: 12oz
  • Minimum laser aperture: 18:01
  • Minimum mechanical aperture: 610mm X 1100mm
  • Plate thickness: FR4/Hi-Tg/Rogers/Halogen Free/RCC/PTFE/Nelco/Mixed pressing material
  • Laminate: HASL、HASL PB FREE Immersion Gold/Tin/Silver Gold Finger Plating OSP、Immersion Gold + OSP

Since the details of the PCB board involve a confidentiality agreement, we will not elaborate.

In the Specification Parameters column, we detail our manufacturing capabilities.

For more information, please contact us.

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Traditional rigid plate processing capability

Number of layers: 1-34L

Plate thickness: 0.2mm-8.0mm

Finished product size: 22.5''* 49''

Minimum line width / spacing: 3.0mil

Maximum thickness ratio: 40:1

Minimum mechanical aperture: 4mil

Hole to conductor distance: 3.5mil

Impedance tolerance (Ω): ±3 (<30) ± 10% (≥ 30)

Surface treatment process: lead-spray tin, chemical immersion gold, electroless nickel-plated palladium gold, immersion tin, immersion silver, full gold plating, organic coating treatment, lead-free spray tin, hard gold plating, soft gold plating, gold finger and so on.

Material: FR-4, high TG, halogen free, high frequency (Rogers, Arlon \ Taconic, Nelco, Taixing Microwave F4B, Isola ...)


Soft and hard composite board processing capability

Mass production capacity using high-density rigid-flex board products

Number of layers / flexible layers: 36/10

Minimum line width: 3.0 / 3.0mil

Plate thickness ratio: 20:1

Hole to conductor distance: 6mil

Impedance tolerance (Ω): 10%

Surface treatment process: lead spray tin, chemical immersion gold, immersion tin, immersion silver, organic coating treatment, lead-free spray tin, hard gold plating, soft gold, silver paste, etc.

Impedance control technique

HDI technology


HDI

3 + C + 3: regular production

4 + C + 4: small amount + regular production

Laser blind hole plating and filling: regular production

Minimum laser drilling (mil): 4


Metal substrate processing capability

Number of layers: 1-12L (metal substrate and metal core board), 2-24L (buried/embedded metal and cold copper and thick copper)

Plate thickness: 0.5-7.0mm Size: Maximum: 610 * 610, Minimum: 5 * 5mm

Machining: X / Y / Z accuracy ± 0.03mm, horn hole, screw hole

Thermal conductivity of thermal conductive material: conventional thermal conductive material: 1-4W / m.k; custom 5-12W / M.K;

Maximum wiring copper thickness: 28OZ

Metal surface treatment: aluminum ordinary oxidation, aluminum hard oxidation, aluminum chemical passivation, sand blasting, wire drawing, surface plating treatment

Surface treatment process: hot air leveling, chemical immersion gold, electroless nickel-plated palladium gold, immersion tin, immersion silver, full gold plating, electroplating soft/hard gold, organic coating treatment, etc.

Type: pre-bonding, post-bonding, sintering process, metal interlayer, buried metal block, cold plate


standard packaging:

Interior: vacuum packaging + foam.

Appearance: foam + carton.

Choose a special package based on the quantity.