Data communication PCB board

PCB supplier from China - Juding Circuit Technology: We have our own PCB manufacturing factory, PCB surface mount factory, component supply chain, PCB design, can provide you with PCB prototype manufacturing, PCB batch manufacturing, PCB prototype SMT surface Placement, PCB batch SMT surface mount, electronic components procurement, PCB design, to provide you with one-stop service, our contact mail:judingdianlu1@163.com

  • Surface treatment: 1-34L
  • Plate: 0.5-17.5mm
  • Maximum board size: 0.1mm
  • Maximum plate thickness ratio: 3mil
  • Maximum copper thickness: 1+n+1、2+n+2、3+n+3
  • Impedance control: 3/3mil
  • Minimum line width and spacing: +/-5%
  • HDI type: 12oz
  • Minimum laser aperture: 18:0
  • Minimum mechanical aperture: 610mm X 1100mm
  • Laminate: HASL、HASL PB FREE Immersion Gold/Tin/Silver Gold Finger Plating OSP、Immersion Gold + OSP
  • Plate thickness: FR4/Hi-Tg/Rogers/Halogen Free/RCC/PTFE/Nelco/Mixed pressing material

Since the details of the PCB board involve a confidentiality agreement, we will not elaborate.

In the Specification Parameters column, we detail our manufacturing capabilities.

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Traditional rigid plate processing capability

Number of layers: 1-34L

Plate thickness: 0.2mm-8.0mm

Finished product size: 22.5''* 49''

Minimum line width / spacing: 3.0mil

Maximum thickness ratio: 40:1

Minimum mechanical aperture: 4mil

Hole to conductor distance: 3.5mil

Impedance tolerance (Ω): ±3 (<30) ± 10% (≥ 30)

Surface treatment process: lead-spray tin, chemical immersion gold, electroless nickel-plated palladium gold, immersion tin, immersion silver, full gold plating, organic coating treatment, lead-free spray tin, hard gold plating, soft gold plating, gold finger and so on.

Material: FR-4, high TG, halogen free, high frequency (Rogers, Arlon Taconic, Nelco, Taixing Microwave F4B, Isola ...)


Soft and hard composite board processing capability

Mass production capacity using high-density rigid-flex board products

Number of layers / flexible layers: 36/10

Minimum line width: 3.0 / 3.0mil

Plate thickness ratio: 20:1

Hole to conductor distance: 6mil

Impedance tolerance (Ω): 10%

Surface treatment process: lead spray tin, chemical immersion gold, immersion tin, immersion silver, organic coating treatment, lead-free spray tin, hard gold plating, soft gold, silver paste, etc.

Impedance control technique

HDI technology


HDI

3 + C + 3: regular production

4 + C + 4: small amount + regular production

Laser blind hole plating and filling: regular production

Minimum laser drilling (mil): 4


Metal substrate processing capability

Number of layers: 1-12L (metal substrate and metal core board), 2-24L (buried/embedded metal and cold copper and thick copper)

Plate thickness: 0.5-7.0mm Size: Maximum: 610 * 610, Minimum: 5 * 5mm

Machining: X / Y / Z accuracy ± 0.03mm, horn hole, screw hole

Thermal conductivity of thermal conductive material: conventional thermal conductive material: 1-4W / m.k; custom 5-12W / M.K;

Maximum wiring copper thickness: 28OZ

Metal surface treatment: aluminum ordinary oxidation, aluminum hard oxidation, aluminum chemical passivation, sand blasting, wire drawing, surface plating treatment

Surface treatment process: hot air leveling, chemical immersion gold, electroless nickel-plated palladium gold, immersion tin, immersion silver, full gold plating, electroplating soft/hard gold, organic coating treatment, etc.

Type: pre-bonding, post-bonding, sintering process, metal interlayer, buried metal block, cold plate



standard packaging:

Interior: vacuum packaging + foam.

Appearance: foam + carton.

Choose a special package based on the quantity.